Silicon bring-up, board design, platform software and lifecycle support from a single engineering team, backed by two decades of industry experience.
ApplicationsSanlayan Product Engineering Services designs the platforms on which a device is validated, released and evaluated, and supports those platforms through volume deployment. Hardware, firmware, software and RF engineering operate as a single program team, which shortens the path from first samples to customer design-in and reduces schedule and technical risk across the semiconductor products.
Dedicated, access-controlled program areas for confidential and pre-release silicon.
Engineering leadership with more than two decades of platform and bring-up experience, with dedicated engineering teams in the United States and India.
Simulation-led hardware development for devices with no prior board revision or field data.
Hardware, firmware, software, RF and mechanical design within one program structure.
Development, debug and measurement, and qualification tools, with prototyping, test and production facilities, including an ISO 7 clean room.
Part of the Sanlayan group, with established radar, RF, digital and power electronics engineering and long-term capital investment.
Application Areas
Post-silicon platforms, physical AI and aerial robotics, high-speed server-grade, safety-critical automotive, and RF and wireless communication, delivered by one program team from silicon to system.
Silicon validation boards, SoC-based modules and evaluation platforms, with the firmware and SDK that take them to customer evaluation.
Sensing, analysing, processing and actuation platforms for industrial cameras, drones and robots, built on SoCs with on-device neural engines.
Server-grade hardware, FPGA and VLSI development and simulation-led PCB design for server platforms, with board support packages (BSPs) and applications for edge and communications platforms.
Hardware, software and radar sensing for automotive and industrial products, developed under ISO 26262 and ASPICE processes.
RF and analog design from antenna to module, with simulation and test across microwave frequencies.
Drivers, operating systems, board support packages and middleware, delivered with the hardware by one program team.
Drivers for a wide range of IO and peripherals on multicore SoCs.
Multiple operating systems on one platform.
Boot, firmware and kernel support for each board and operating system.
Frameworks and applications above the BSP.
Single board computer for signal processing, with 20 cores and 256GB DDR5 ECC memory.
2x XMC · Linux, VxWorks, Windows
Third generation RF system on chip with quad core Arm and 8 or 16 channel 14 bit ADC and DAC.
Linux and bare metal
Air cooled and conduction cooled builds for SWaP constrained platforms.
Up to 64GB DDR4 · XMC expansion
GPU with 24GB GDDR7 ECC memory for AI at the tactical edge.
320 tensor cores · 2x video out
Two Versal Premium adaptive SoCs with dedicated high speed interconnects and 32 lane PCIe Gen4 expansion.
VITA 66 backplane
Solid state DC to AC converters, battery chargers and inverters for vehicle platforms.
500W to 10kW · 18 to 36V DC input
